Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound was written by Kumamoto, Seishi;Sakurai, Hitoshi;Kukimoto, Youichi;Suganuma, Katsuaki. And the article was included in Journal of Electronic Materials in 2008.Synthetic Route of C10H22O3 The following contents are mentioned in the article:
The effect of a flux containing Cu(II) stearate (barrier flux) on the strength of soldered joints between an electroless Ni-Au surface finish and two Pb-free soldering systems, Sn-3Ag-0.5Cu and Sn-3.5Ag (weight%), was examined Pull and shock tests showed that barrier flux gave a higher joint strength for both solder compositions than did a flux containing no Cu compounds Interface anal. revealed that a thin P-rich layer and refined Cu-Ni-Sn intermetallic compounds were formed at the joint interface when barrier flux was used. It is assumed that the supply of Cu from barrier flux suppresses diffusion of Ni into the solder. This study involved multiple reactions and reactants, such as 2-(2-(Hexyloxy)ethoxy)ethanol (cas: 112-59-4Synthetic Route of C10H22O3).
2-(2-(Hexyloxy)ethoxy)ethanol (cas: 112-59-4) belongs to ethers. Carboxylic acid esters of low molecular weight are colourless, volatile liquids with pleasant odours, slightly soluble in water. Because of their lack of hydrogen-bond-donating ability, esters do not self-associate. Consequently, esters are more volatile than carboxylic acids of similar molecular weight.Synthetic Route of C10H22O3
Referemce:
Ether – Wikipedia,
Ether | (C2H5)2O – PubChem